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Burn-in Socket

Model Name : Burn-in Socket
DediProg's Burn-in Socket features a modular design, enabling the installation of a heat sink or an ICTC module based on the testing requirements.
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Burn-in Socket

DediProg's Burn-in Socket features a modular design that allows for the installation of a heatsink or ITC module according to testing needs, and includes thermal analysis for close evaluation. It contains high-performance spring-loaded pins that provide stable testing performance across a wide temperature range. For high pin count testing, we also offer a patented labor-saving structure to enhance ease of use.
 


 

SPEC

  1. IC Size: 30 x 30 mm (max.)
  2. Pin Count: ~3,000 Pin
  3. Operating Temp.: -55℃~150℃

 

Contact Element

  1. Pogo Pin
Contact ElementPogo Pin
Life Time ~ 1,000,000 Cycle
Pitch>0.15mm
Temperature-55℃ to 175℃
Bandwidth<25GHz
IC PackageAll IC Package
Ease of RepairLow

 

Material

  1. PEEK-Ceramic
  2. Ultem-2300
  3. Aul.-6061

 


 

Model
 

Model

M2632

M2632-HS

M5060

M5060-HS

Withstand voltage AC 700V For 1 Min. Insulation Resistance 1000MΩ at DC 500V

Outer Diameter

26 x 32mm

26 x 32mm

50 x 60mm

50 x 60mm

IC Size Range

0.8 x 0.8mm ~ 13 x 13mm

0.8 x 0.8mm ~ 13 x 13mm

< 30 x 30mm

< 30 x 30mm

Operation Temperature

-55~150 ℃

Max. Pin Count 

~300 Pin

~300 Pin

~3000 Pin

~3000 Pin

Thermal Power Diss.

~2W

~10W

~10W

~50W

 

HAST (Highly-Accelerated Temperature & Humidity Stress Test)
→ 130°C / 85% at 480hrs    
HTOL (High Temperature Operating Life Test)
 → 150°C at 1000hrs 
LTOL (Low Temperature Operating Life Test)
→ -55°C at 1000hrs

 


 

Structure

 

Model: M5060 / M7080 Burin-in Socket

M5060 / M7080 Burin-in Socket

 

Model: M2632 Burn-in Socket

M2632 Burin-in Socket
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