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 IC Test Socket


 

ic test socket


 

IC Test Socket

Stable transmission, durability as always.

 

 

 

       

 

The IC Test Sockets are widely used for back-end testing of chips finalizing. It can work under strict testing conditions and transmit signals with chips without soldering them onto a PCB, which helps the engineers quickly and accurately implement the inspection procedure. 
DediProg's IC test socket supports burn-in tests, packaging tests, and final tests.

 

 


 

 

 

 

 

Final Test Socket


The Final Test Socket is a specified design for testing the high transmission chips installed on automotive, data centers, and IoT devices. The Coaxial structure can support engineering and mass production modes. It also minimized the transmission impedance and energy dissipation, which achieved extended efficiency and stability in the signal delivery.

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Burn-in Socket


DediProg's Burn-in Socket features a modular design, allowing for adding a heat sink or ITC module based on the testing requirements. It includes a high-performance pogo pin for stability and a wide operating temperature range. Additionally, our patented labor-saving structure simplifies High Pin Count testing, ensuring ease of use. 

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Open Top Socket


The Open Top Socket is commonly used in automated testing equipment. It can be customized in many parts, including alloy materials, probe structure, and surface plating. This item can support multiple tests in the back-end processes, including high frequency, high transmission speed, and wide thermal range inspection. Its modular design simplifies production, and high-performance Pogo Pins can be applied to enhance product lifespan.

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DDR5/DDR4 Module Test Socket

As the transmitting speed for DDR5/DDR4 SDRAM is upgraded, the DDR socket applies the Ultra-thin Conductive Adhesive (PCR) to achieve excellent performance in high-speed signal transmitting (>6000MHz). The DDR5/DDR4 Socket is designed via an efficient limit frame, minimizing the replacement time via fast removal functions.

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Pogo Pin

We focus on the R&D of materials and manufacturing processes for Pogo Pins. To meet strict testing requirements, we offer corresponding material technologies that reduce cleaning frequency and improve testing yield. We accept custom orders for various probe specifications, including shape, material, and elasticity. We can also provide S-parameter simulation reports.

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Pressure Conductive Silicone Rubber, P.C.R

High-speed transmission, low resistance, and no damage to solder balls. The special molding technique ensures that conductive particles are tightly aligned, resulting in excellent performance in both contact and resistance.

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One-stop Service

 

Fast Lead Time

 

RD Capabilities

We design and produce everything independently, ensuring stable and safe quality control. 

 

We can ship quickly within 2-4 weeks of placing an order.

 

Our R&D team is experienced in discovering and developing.